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SQT-108-01-L-D-RA-008123
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SQT-108-01-L-D-RA-008
  • Manufacturer No:
    SQT-108-01-L-D-RA-008
  • Manufacturer:
    Samtec Inc.
  • Category:
    Rectangular Connectors - Headers, Receptacles, Female Sockets
  • Datasheet:
    SQT-108-01-L-D-RA-008
  • SKU:
    3489290
  • Description:
    POLARIZED Rectangular Connector Receptacle

SQT-108-01-L-D-RA-008 Details

POLARIZED Rectangular Connector Receptacle

SQT-108-01-L-D-RA-008 Specification Parameters

  • Part Status: Active
  • IEC Conformance: NO
  • Mixed Contacts: NO
  • RoHS Status: ROHS3 Compliant
  • Packaging: Bulk
  • ECCN Code: EAR99
  • Lead Free: Lead Free
  • Termination: Solder
  • Factory Lead Time: 3 Weeks
  • Option: GENERAL PURPOSE
  • Gender: Female
  • Fastening Type: Push-Pull
  • Number of Positions: 16
  • Style: Board to Board or Cable
  • Connector Type: Receptacle
  • HTS Code: 8536.69.40.40
  • Mounting Type: Through Hole, Right Angle
  • Lead Length: 2.29mm
  • Number of Positions Loaded: 15
  • Contact Length - Post: 0.090 2.29mm
  • Voltage - Rated AC: 450V
  • Current Rating (Amps): 5.1A per Contact
  • DIN Conformance: NO
  • Filter Feature: NO
  • MIL Conformance: NO
  • Number of Rows: 2
  • Mount: Through Hole
  • Contact Finish - Mating: Gold
  • Insulation Color: Black
  • Operating Temperature: -55°C~125°C
  • Contact Finish - Post: Tin
  • Material Flammability Rating: UL94 V-0
  • Contact Material: Phosphor Bronze
  • Contact Shape: Square
  • Contact Finish Thickness - Mating: 10.0μin 0.25μm
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • UL Flammability Code: 94V-0
  • Pitch - Mating: 0.079 2.00mm
  • Additional Feature: POLARIZED
  • Row Spacing - Mating: 0.079 (2.00mm)
  • Contact Type: Forked
  • Insulation Height: 0.157 4.00mm
  • Voltage - Rated: 450VAC
  • Series: SQT

Samtec Inc. — Manufacturer Introduction

Samtec Inc.
Samtec is a worldwide manufacturer of P.C. Board level interconnects. Samtec is a global manufacturer of a broad line of electronic interconnect solutions, including micro pitch board-to-board systems (on .100”, 2 mm, .050”, 1 mm, .8 mm, .635 mm, .5 mm, and .4 mm pitch), high-speed mezzanine systems, high-density arrays, IC-to-Board, Future-Proof/Active Optics, rugged/power systems, and cable assemblies (IDC, discrete wire, sealed/circulars, and high speed). To meet the interconnect challenges of tomorrow and beyond, Samtec has developed Technology Centers dedicated to developing and advancing technologies and products that provide both performance and cost benefits, ensuring complete system optimization from the bare die to an interface 100 meters away, and all interconnect points in between.

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